Technologies and Engineering
Technologies and Engineering
ISSN 2786-5371 e-ISSN 2786-538X
DOI: 10.30857/2786-5371
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Author

Yuliia Gerasymenko

Assistant

National Technical University of Ukraine "Igor Sikorsky Kyiv Polytechnic Institute"

03056, 37 Beresteiskyi Ave., Kyiv, Ukraine

https://orcid.org/0000-0002-7791-6821

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open access

Keywords: hot-melt adhesive; adhesive bond; mathematical model; numerical simulation

Study of the thermal glue joint formation process

Yuliia Gerasymenko, Oleksandr Sokolskyi

https://doi.org/10.30857/2786-5371.2022.1.1

Suggested citation

Gerasymenko, Y., & Sokolskyi, O. (2022). Study of the thermal glue joint formation process. Technologies and Engineering, 23(1), 9-19. https://doi.org/10.30857/2786-5371.2022.1.1
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  • 21.02.2022
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  • Technologies and Engineering - Vol. 23, No. 1, 2022